News from USA and Asia

SD Association reveals new Memory Card Design for very fast Cards

06.09.2010

The SD Association has defined a new, dual-row pin memory card design achieving bus interface speeds of up to 300 megabytes per second for SDXC and SDHC devices and memory cards. It is fully backwards compatible.

Automotive DirectFET2 Power MOSFETs optimized for Switching Applications

06.09.2010

International Rectifier announced the introduction of two automotive DirectFET®2 power MOSFETs optimized with low gate charge for switching applications including SMPS and other automotive power conversion applications.

Tool Kit enables two-way Communication between embedded Wi-Fi Designs and Web Applications

06.09.2010

Arrayent, who sells an end-to-end communication system that enables product companies to connect their products to Internet services at low cost and high reliability, announced its Internet-Connect Tool Kit for embedded Wi-Fi apps.

Single-chip Proximity/Touch Sensor Solution for passive RKE Systems

06.09.2010

Maxim Integrated Products introduces the MAX1441, a fully integrated, 2-channel, proximity and touch sensor IC for automotive passive-entry (PRKE) and user-control systems. This device provides a complete, stand-alone solution.

LTE Base-Station Emulator speeds Development and Verification of LTE User Equipment

06.09.2010

Agilent Technologies announced the PXT Wireless Communications Test Set, a powerful, common hardware test platform for use across the LTE development lifecycle.

Non-diffused 3-mm WLED utilizes InGaN Technology, achieves Intensity up to 11,250 mcd

06.09.2010

Vishay Intertechnology announced a white, non-diffused 3-mm LED for high-end applications with extreme luminous intensity requirements. Utilizing an ultrabright InGaN technology, the VLHW4100 features a high luminous intensity.

Round Two of the Solar Shakeout: Who will thrive, survive, or dive?

06.09.2010

Despite a strong opening to 2010 for the solar market, manufacturers are now bracing themselves for further price declines and stiffer competition - and module makers prepare for a renewed trench war.

IBM to ship fastest Microprocessor clocks 5.2 GHz

03.09.2010

IBM announced details of the world's fastest computer chip -- the microprocessor in a new version of the IBM mainframe. This world record-breaking speed is necessary for businesses managing huge workloads.

Harwin signs worldwide Distribution Deal with Digi-Key

03.09.2010

Harwin, a hi-rel connector and SMT board hardware manufacturer, has signed a worldwide distribution agreement with Digi-Key, the electronics components distributor.

SDI Equalizer extends Reach of Broadcast Video Signals by 40 Percent

03.09.2010

A new serial digital interface cable equalizer (LMH0394) from National Semiconductor extends the reach of broadcast video signals by 40 percent (200 m at 3 Gbps) while delivering half the power of comparable equalizers.

Small 1.8 A Dual PoL-Regulator with integrated VID pins for independent Control of each Output

03.09.2010

Semtech announced the latest device in its buck controller platform. The new SC283 is the smallest 1.8 A dual-channel regulator for point-of-load (POL) applications, combining two step-down regulators in an ultra-small MLPQ package.

Gyro-Sensor offers a high scale Factor and wide Sensing Range

03.09.2010

Epson has completed commercial development and launched volume production of the XV-3700CB, a high-sensitivity gyro-sensor with a wide detection range that has been optimized as an input device for motion user interfaces.

1200 V, 100 A, half-bridge, all-SiC Power Module

03.09.2010

SemiSouth Laboratories presented a paper entitled ‘Low Switching Energy 1200 V Normally-Off SiC VJFET Power Modules’ at the European SiC and Related Materials Conference.

The perfect Nanocube: Precise Control of Size, Shape, and Composition

03.09.2010

With growing interest in using nanoparticles for everything from antibacterial socks to medical imaging to electronic devices, the need to understand the environmental, health and safety risks of these particles also grows.

Expanded Instrument Service Offerings to keep Customers up and testing

03.09.2010

Tektronix announced Gold Care Plans designed to give customers a worry-free ownership experience across mid-range and high-performance test instruments such as oscilloscopes and spectrum analyzers.

Clock Chip supports Duration Timing from 1 ms to 9.5 hrs

02.09.2010

Linear Technology announces the LTC6991, a simple, accurate low frequency clock specifically designed for long duration timing applications. The clock is the latest part in the TimerBlox family of versatile silicon timing devices.

28nm analog/mixed-signal Production Design Flow Development Kit

02.09.2010

Globalfoundries showcased the first open-access 28 nm Analog/Mixed-Signal (AMS) production design flow development kit. The company is making the flow available to customers as a platform to build upon foundry methodologies.

HP collaborates with Hynix to bring the Memristor to Market in next-generation Memory

02.09.2010

HP announced that it has entered into a joint development agreement with Hynix Semiconductor Inc., a memory supplier, to bring memristor, a new circuit element to market in future memory products.

Foton Motor and Freescale Semiconductor announce Automotive Joint Lab

02.09.2010

Foton and Freescale Semiconductor announced the establishment of the Automotive Joint Lab. The lab is Foton Motor’s first formal cooperation project in automotive electronics.

USB MCUs feature very low Power Consumption in small Packages

02.09.2010

Microchip Technology expanded its 8-bit and USB MCU lines with the PIC18F47J53. Featuring XLP technology for eXtreme Low Power Consumption, the new MCU provides up to 128 KB Flash program memory and 4 KB RAM.

Data Transfer Module for remote Tachograph Download Service

02.09.2010

Qualcomm Enterprise Services Europe BV, a wholly owned subsidiary of Qualcomm and a provider of business-to-business wireless enterprise applications and services, announced the Remote Tachograph Download Service.

USB Interface IC simplifies Touch Screen Application Development

02.09.2010

Silicon Laboratories introduced a USB touch screen bridge IC that streamlines the connection between touch controllers and host CPUs in computing systems with large displays.

MPEG Video SoC Market riding along with the Consumer Electronics Market

02.09.2010

Growth in shipments of various video products in the consumer electronics market, even in a year with economic uncertainty like 2009, helped the MPEG video SoC market reach over 650 million units in 2009, says In-Stat.

MCU Peripheral Explorer Kit and free Teaching ROM help launching real-time Control Applications

02.09.2010

TI announced its enhanced floating-point F28335 Delfino™ MCU Peripheral Explorer Kit and free C2000 MCU Teaching ROM. The new C2000 Teaching ROM is a comprehensive guide to C2000 MCUs.

24nm Process for 64 Gb NAND Flash Memory

02.09.2010

Toshiba started mass production of NAND flash memories fabricated with a 24nm process technology. This technology has already been applied to 2 bit-per-cell 64-Gb chips that offer the highest density on a single chip (8 GB).

VeriStand 2010 scales from high-performance Multichassis Systems to low-cost, ruggedized Applications

02.09.2010

National Instruments announced VeriStand 2010, which includes enhancements that expand its capabilities for hardware-in-the-loop (HIL) and real-time testing by supporting high-performance, multiple chassis PXI systems.

Cheap mobile Phones aren't the whole Story in emerging Markets

02.09.2010

In depth interviews with low-income first-time mobile phone owners in Manila show that basic no-frills phones will meet the needs of some emerging market consumers, but others want more features – and will pay for them.

NTC Thermistors with 1.6-mm Body Sensing Diameter, and fast Response Time down to ≤ 0.7 s

02.09.2010

Vishay Intertechnology announced a new series of micro-chip negative temperature coefficient (NTC) thermistors with a very small maximum body sensing diameter of 1.6 mm and fast response times of ≤ 3 s in air and ≤ 0.7 s in oil.

2 A, 42 V Boost Converter offered in high Temperature Grades

01.09.2010

Linear Technology announces the "H-grade" and "MP-grade" versions of the LT3580, a current-mode, fixed frequency step-up DC/DC converter with internal 2 A, 42 V switch. The device operates from an input voltage range of 2.5 V to 32 V.

Reflective HTPS Panels support full HD and provide Contrast Ratio of 100,000:1 or higher

01.09.2010

Epson has developed and begun volume production of the first reflective high-temperature polysilicon ("reflective HTPS") TFT liquid crystal panels for 3LCD projectors. The new panels measure 0.74 inches on the diagonal.

Intel targets mobile CE with Infineon

01.09.2010

In its efforts to complete the wireless puzzle, Intel announced recently that it has acquired the wireless assets from German semiconductor vendor Infineon, a group Intel has partnered with in mobile solutions for several years.

CapSense Express Controller simplifies Implementation of capacitive Touch Sensing Solutions

01.09.2010

Cypress Semiconductor announced a CapSense capacitive touch-sensing controller that enables designers to achieve mechanical button replacement (MBR) without having to write firmware or learn to use new software tools.

Fully integrated 300-mm Line for via-mid 3D ICs

01.09.2010

In another step towards driving the maturity of 3D IC integration, Sematech’s 3D Interconnect program completed its 300 mm 3D IC pilot line, operating at the CNSE's Albany NanoTech Complex.

Fully programmable, multistate, dual digital VGA reduces Solution Footprint by 32%

01.09.2010

Maxim Integrated Products introduces the MAX2063, the only fully programmable, multistate, dual-channel, digital IF/RF variable-gain amplifier (VGA). This easy-to-control device delivers an unparalleled component integration.

MC1323x Family is optimized for Consumer Applications using ZigBee RF4CE Technology

01.09.2010

Freescale’s MC1323x device family provides a comprehensive, highly integrated solution with premier processing capabilities and minimal power consumption. This family features also an 8-bit HCS08 microcontroller.

8-MP complete Camera Solution shortens Camera Design Time

31.08.2010

Aptina announced its new feature-rich 8-MP CCS8140 imaging solution. The new solution combines a high-quality MT9E013 8-MP CMOS image sensor with an MT9E311 imaging co-processor.

1490-1550 MHz VCO features a typical Phase Noise of -115 dBc/Hz @ 10 kHz Offset

31.08.2010

Crystek's CVCO55CC-1490-1550 VCO (Voltage Controlled Oscillator) operates from 1490 MHz to 1550 MHz with a control voltage range of 1.0 V~10 V. This VCO features a typical phase noise of -115 dBc/Hz @ 10KHz offset.

3M to acquire Cogent, broadens biometric Security Solutions

31.08.2010

3M and Cogent announced that they have entered into a definitive agreement for 3M’s acquisition of Cogent Inc. for $10.50 per share. The proposed transaction has an aggregate value of approximately $943 million.

-36-V, 200-mA LDO improves Efficiency and Accuracy in noise-sensitive Applications

31.08.2010

TI introduced the first -36-V low dropout regulators (LDO). The TPS7A30, paired with the positive voltage TPS7A49, provides designers with a total solution for powering precision analog applications.

Intel to acquire Infineon's Wireless Solutions Business

31.08.2010

Infineon Technologies and Intel have entered into a definitive agreement to transfer Infineon's Wireless Solutions (WLS) business to Intel in a cash transaction valued at approximately $1.4 billion.